Compact and Low-Profile On-Chip Antenna Using Underside Electromagnetic Coupling Mechanism for Terahertz Front-End Transceivers

The results presented in this paper show that by employing a combination of metasurface and substrate integrated waveguide (SIW) technologies, we can realize compact low-profile antenna overcomes the drawbacks narrow-bandwidth low-radiation properties encountered terahertz antennas on-chip (AoC). In addition, an effective RF cross-shaped feed structure is used to excite from its underside coupling, electromagnetically, energy through multi-layered structure. mechanism facilitates integration with circuits. proposed constructed five stacked layers, comprising metal–silicon–metal–silicon–metal. dimensions AoC are 1 × 0.265 mm3. shown have impedance match, radiation gain efficiency ? ?15 dB, 8.5 dBi 67.5%, respectively, over frequency range 0.20–0.22 THz. design viable for front-end applications.